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CEI EN 60749-16 : 2005

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2005

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance (for guidance)
8 Detail specification
9 Summary
Bibliography

Describes to detect the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-43. (11/2005)
DocumentType
Standard
Pages
12
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 60749-16:2003 Identical
EN 60749-16:2003 Identical

IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements

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PDF - English
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