SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report
        form/checklist (example only - not a
        mandatory template)
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-15 (04/2004) Supersedes CEI EN 60749. (05/2008) 1ED 2004 Edition is valid until 07-04-2020. (12/2017)
DocumentType	Standard
Pages	12
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60749 : 2000 AMD 2 2004

Standards	Relationship
EN 60749-3:2017	Identical
IEC 60749-3:2017	Identical

EN 61340-5-1:2016/AC:2017-05	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 61340-5-1:2016	Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 62483:2013	Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

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CEI EN 60749-3 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

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