SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 HAST test - General remarks
5 Test apparatus
6 Test conditions
7 Procedure
8 Failure criteria
9 Safety
10 Summary
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Gives the highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-16 (04/2004) Supersedes CEI EN 60749. (05/2008) 1ED 2004 Edition is valid until 07-04-2020. (12/2017)
DocumentType	Standard
Pages	16
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60749 : 2000 AMD 2 2004

Standards	Relationship
IEC 60749-4:2017	Identical
EN 60749-4:2017	Identical

IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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CEI EN 60749-4 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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