Name: CEI EN 60749-43 : 1ED 2018
Brand: CEI

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS

Published date

28-03-2018

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Product categories and applications
5 Failure
6 Reliability test
7 Stress test methods
8 Supplementary tests
9 Summary table of assumptions
10 Summary
Bibliography

Provides guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs).

Committee	TC 47
DevelopmentNote	Classificazione CEI 309-86. (02/2018)
DocumentType	Standard
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 60749-43:2017	Identical
EN 60749-43:2017	Identical

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-28:2017	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
EN 60749-23:2004/A1:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
EN 60749-15:2010/AC:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
IEC 60749-21:2011	Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-29:2011	Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
EN 60749-42:2014	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
EN 60749-29:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
EN 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-21:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
IEC 60749-15:2010	Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-26:2013	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-42:2014	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
EN 60749-26:2014	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-23:2004+AMD1:2011 CSV	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
EN 60749-28:2017	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level