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CEI EN 62047-10 : 2012

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
        finite element method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-99. (08/2012)
DocumentType
Standard
Pages
20
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62047-10 : 2011 Identical
IEC 62047-10:2011 Identical

ASTM E 9 : 2009 Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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Hardcopy - English
PDF - English
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