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CEI EN 62047-11 : 2014

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2014

FOREWORD
1 Scope
2 Normative References
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Test piece fabrication
Annex B (informative) - Test piece handling example
Annex C (informative) - Test piece releasing process
Annex D (informative) - Out-of-plane test setup and
        test piece example
Annex E (informative) - Data analysis example in
        in-plane test method
Annex F (informative) - Data analysis example in
        out-of-plane test method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the test method to measure the linear thermal expansion coefficients of thin free-standing solid microelectro-mechanical system materials with length between 0,1 mm and 1 mm and width between 10 [mu]m and 1 mm and thickness between 0,1 [mu]m and 1 mm, which are main structural materials used for MEMS, micromachines and others.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-114. (05/2014)
DocumentType
Standard
Pages
26
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62047-11 : 2013 Identical
IEC 62047-11:2013 Identical

ASTM E 228 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
ASTM E 289 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry

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