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CEI EN 62047-14 : 2013

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2013

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Testing method
5 Test procedure and analysis
6 Test report
Annex A (informative) - Principles of the forming
        limit diagram
Annex B (informative) - Grid marking method
Annex C (informative) - Gripping method
Annex D (informative) - Strain measuring method
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Gives definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 [mu]m to 300 [mu]m.

Committee
CT 309
DevelopmentNote
Classificazione CEI 309-36. (05/2013)
DocumentType
Standard
Pages
24
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 62047-14:2012 Identical
EN 62047-14:2012 Identical

EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

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