SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Test piece materials
4 Test piece fabrications
5 Plane shape of test piece
6 Test piece thickness
7 Gauge mark
8 Test
9 Document attached to standard test pieces
Annex A (informative) - Test piece
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Describes the standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 [mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-1029. (09/2015)
DocumentType	Standard
Pages	16
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN 62047-3 : 2006	Identical
IEC 62047-3:2006	Identical

IEC 62047-2:2006	Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006	Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
ISO 17561:2016	Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance

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CEI EN 62047-3 : 2007

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory