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CEI EN 62137-1-2 : 2008

Current

Current

The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST

Available format(s)

Hardcopy , PDF

Language(s)

English - Italian

Published date

01-01-2008

1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
6 Mounting method
7 Test conditions
8 Test procedure
9 Items to be included in the test
   report
10 Items to be given in the product
   specification
Annex A (normative) - Shear strength test - Details
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Pertains to leadless surface mounting components and surface mounting connectors to which pull test is not applicable.

Committee
CT 309
DevelopmentNote
Classificazione CEI 91-46. (12/2007)
DocumentType
Standard
Pages
34
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62137-1-2:2007 Identical
IEC 62137-1-2:2007 Identical

IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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