SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST

Available format(s)

Hardcopy , PDF

Language(s)

English - Italian

Published date

01-01-2009

Publisher

Comitato Elettrotecnico Italiano

1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
6 Mounting method
7 Test method and procedure and judgment
  conditions
8 Items to be included in the test report
9 Items to be given in the product specification
Annex A (normative) - Drop impact test equipment
Annex B (normative) - Test method and procedure
Annex C (informative) - Example of test equipment
        and procedure
Annex D (informative) - Example of strain gauge
        attachment procedure
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European publications

Pertains to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-60. (12/2009)
DocumentType	Standard
Pages	46
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN 62137-1-3:2009	Identical
IEC 62137-1-3:2008	Identical

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-27:2008	Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60068-2-31:2008	Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens
EN 61249-2-7:2002/corrigendum:2005	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61192-1:2003	Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions

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CEI EN 62137-1-3 : 2009

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

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