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CEI EN 62137-1-5 : 2010

Current
Current

The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
Available format(s)

Hardcopy , PDF

Language(s)

English - Italian

Published date

01-01-2010

Publisher

Comitato Elettrotecnico Italiano

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment and materials
5 Mounting
6 Test conditions
7 Items to be included in the test report
8 Items to be given in the product
  specification
Annex A (normative) - Mechanical shear
        fatigue test equipment
Annex B (normative) - Mechanical shear
        fatigue test procedure
Annex C (informative) - Evaluation of mechanical
        properties of a single solder joint by mechanical
        shear fatigue test
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their corresponding
         European publications

Specifies in this part of IEC 62137 applies to area array packages, such as BGA.

Committee
CT 309
DevelopmentNote
Classificazione CEI 91-63. (05/2010)
DocumentType
Standard
Pages
46
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62137-1-5:2009 Identical
IEC 62137-1-5:2009 Identical

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
CEI 9-18 : 1ED 1997 RESISTENZE OHMICHE INSERITE NEI CIRCUITI DI POTENZA DEI ROTABILI AUTOMOTORI
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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Hardcopy - English - Italian
PDF - English - Italian
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