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CEI EN 62435-1 : 1ED 2017

Current

Current

The latest, up-to-date edition.

ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL

Published date

10-10-2017

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms definitions and abbreviated terms
4 Purpose of long-term storage
5 Logistics
6 Storage considerations for devices after card (or other)
   attachment
7 Handling
8 Inspection
9 Inventory control process
10 Transportation
11 Lead finishes
12 Kitting and lot control
13 Validation
14 Unplanned storage and types of storage
15 Other things to store in addition to the components
16 Storage facility
17 Policies
18 Legislation and environmental issues
Annex A (informative) - Example checklist for project
        managers
Annex B (normative) - Example checklist for long-term
        storage facilities
Annex C (informative) - Example of a component list
Annex D (informative) - Examples of periodic and/or
        de-stocking tests
Annex E (informative) - Parameters influencing the
        quantity of components to be stored
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Contains the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-141. (10/2017)
DocumentType
Standard
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62435-1:2017 Identical

EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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