Name: CEI EN 62739-3 : 1ED 2017
Brand: CEI

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS

Published date

10-10-2017

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Selection of the appropriate erosion test method
6 Common items for each test method
7 Overview of the test methods
Annex A (informative) - Selection of test temperature, test
        duration and bending stress
Annex B (informative) - Maximum depth and other
        measurements
Annex C (informative) - Erosion mechanism
Annex D (informative) - Thermal acceleration for erosion
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Committee	CT 309
DevelopmentNote	Classificazione CEI 91-92. (10/2017)
DocumentType	Standard
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 62739-3:2017	Identical
EN 62739-3:2017	Identical

IEC 62739-1:2013	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 62739-1 : 2013	TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
EN 62739-2:2016	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 62739-2:2016	Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications