DD IEC PAS 62137-3 : DRAFT 2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
31-03-2012
23-11-2012
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable
test method
4.1 Stress to solder joints in the field
and test methods
4.2 Selection of test methods based on
the shapes and terminals of electronic
components
5 Common subjects in each test method
5.1 Mounting device and materials used
5.2 Soldering condition
5.3 Accelerated endurance test
5.4 Selection of test conditions and
analysis of test results
6 Test method
6.1 Body strength test of SMD before
and after the rapid temperature
change test
6.2 Cyclic bending strength test
6.3 Mechanical shear fatigue test
6.4 Cyclic drop test
6.5 Strength test of leaded component
6.6 Fillet lifting phenomenon observation
of leaded component
Annex A (informative) - Condition of rapid temperature
change test
Annex B (informative) - Soldered joint test by electrical
conduction
Annex C (informative) - Torque shear strength test
Annex D (informative) - Monotonic bending strength test
Annex E (informative) - Cyclic steel ball drop strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Fillet lifting phenomenon observation
of leaded component solder joint
and the life test by electrical
conduction
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