DD IEC/PAS 62435:2005
Current
The latest, up-to-date edition.
Hardcopy , PDF
English
30-01-2006
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Storage decision criteria
3.1 Advantages
3.1.1 Technical simplicity - Rapidity
3.1.2 Solution durability
3.1.3 Preventive storage
3.2 Hazards - Drawbacks
3.2.1 Generic aging hazard
3.2.2 Poor stock dimensioning
3.2.3 Incorrect control of reliability during storage
3.2.4 Freezing equipment functionalities
3.3 Storage cost
3.4 Decision criteria
4 Purchasing - Procurement
4.1 List of components
4.2 Quantity of components to be stored
4.2.1 Production stock
4.2.2 Field service stock
4.3 When is it worth keeping in stock?
4.4 Procurement recommendations
5 Technical validation of the components
5.1 Purpose
5.2 Relevant field
5.3 Test selection criteria
5.4 Measurements and tests
5.4.1 Sampling
5.4.2 Visual examination, sealing, solderability
5.4.3 Compliance with the electrical specifications
5.4.4 Assessment of the supplied batch reliability
5.4.5 Manufacturing control check (technological analysis)
5.5 Sanction
6 Conditioning and storage
6.1 Type of environment
6.2 Elementary storage unit
6.3 Stock management
6.4 Redundancy
6.5 Identification - Traceability
6.6 Initial packaging
6.7 Stabilization bake
6.8 Storage conditions
6.8.1 Storage area
6.8.2 Temperature
6.8.3 Temperature variations
6.8.4 Relative humidity - Chemical attacks - Contamination
6.8.5 Pressure
6.8.6 Electrostatic discharges
6.8.7 Vibration - Mechanical impacts
6.8.8 Electromagnetic field - Radiation
6.8.9 Light
6.9 Maintaining storage conditions
7 Periodic check of the components
7.1 Objectives
7.2 Periodicity
7.3 Tests during periodic check
8 Destocking
8.1 Precautions
8.1.1 Electrostatic discharges
8.1.2 Mechanical impacts
8.2 Inspection
9 Feedback
Annex A (informative) Example of a component list
Annex B (informative) Examples of periodic and/or destocking
tests (1/3)
Annex C (informative) Parameters influencing the final price
of the component storage
Annex D (informative) Parameters influencing the quantity of
components to be stored
Annex E (normative) Failure mechanisms: Encapsulated and
non-encapsulated active components
Annex F (normative) Failure mechanisms: GaAs components
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