MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2002

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
   pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
   1,00 mm pitch
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Gives the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

DevelopmentNote	Supersedes DIN IEC 47D-301-CD. (09/2002)
DocumentType	Standard
Pages	14
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
UNE-EN 60191-6-2:2003	Identical
BS EN 60191-6-2:2002	Identical
NF EN 60191-6-2 : 2002	Identical
EN 60191-6-2:2002	Identical
IEC 60191-6-2:2001	Identical
I.S. EN 60191-6-2:2002	Identical