MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2002

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack. Also specifies outlines and obtain interchangeability of G-QFP.

DevelopmentNote	Supersedes DIN IEC 47D-131-CD. (05/2002)
DocumentType	Standard
Pages	14
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
BS EN 60191-6-8:2001	Identical
UNE-EN 60191-6-8:2002	Identical
IEC 60191-6-8:2001	Identical
NF EN 60191-6-8 : 2002	Identical
I.S. EN 60191-6-8:2002	Identical
EN 60191-6-8:2001	Identical