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EN 140401:2009

Current
Current

The latest, up-to-date edition.

Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
Published date

08-04-2009

Introduction
1 Characteristics and ratings
  1.1 Dimensions and ratings
  1.2 Derating curve
  1.3 Resistance range and tolerance on rated resistance
       1.3.1 Version A
       1.3.2 Version E
  1.4 Variation of resistance with temperature and temperature
       rise
  1.5 Climatic categories
  1.6 Limits for change of resistance at tests
  1.7 Non-linearity
  1.8 Tests related to soldering
       1.8.1 Severities for solderability testing
       1.8.2 Severities for testing resistance to soldering
              heat
  1.9 Marking, packaging and ordering designation
       1.9.1 Marking of the component
       1.9.2 Packaging
       1.9.3 Marking of the packaging
       1.9.4 Ordering information
  1.10 Additional information (not for inspection purpose)
       1.10.1 Storage
       1.10.2 Mounting
       1.10.3 Soldering process
       1.10.4 Use of cleaning solvents
2 Quality assessment procedures
  2.1 General
       2.1.1 Zero defect approach
       2.1.2 100% Test
       2.1.3 0 Ohm Resistors
       2.1.4 Certificate of Conformity (CoC)
       2.1.5 Certified test records
       2.1.6 Failure rate level
  2.2 Qualification approval
       2.2.1 Version A
       2.2.2 Version E
  2.3 Quality conformance inspection
       2.3.1 Qualification approval according to
              IEC QC 001002-3:2005, Clause 3
       2.3.2 Technology approval according to
              IEC QC 001002-3:2005, Clause 6
       2.3.3 Non-conforming items
Annex A (normative) - Fixed sample size Qualification Approval
        and Quality Conformance Inspection test schedule for
        fixed low power film resistors
Annex B (informative) - Letter symbols and abbreviations
Bibliography

A blank detail specification is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with European standards nor shall they be so described. In the preparation of the detail specification the content of EN 140400:2003, 1.2 shall be taken into account. The detail specification should be written by using the preferred values given in EN 140400. The detail specification should contain a table of contents prior the first page of the actual specification. For the use of SI units refer to ISO 1000, for the use of letter symbols to be used in electrical technology, refer to EN 60027-1. Notes in this document shall be considered as guidance and are not part of the detail specification itself.

Committee
CLC/TC 40XB
DevelopmentNote
Supersedes CECC 40401 (08/2002)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

Standards Relationship
I.S. EN 140401:2009 Identical
PN EN 140401 : 2009 Identical
NEN EN 140401 : 2009 Identical
NF EN 140401 : 2009 Identical
DIN EN 140401:2009-12 Identical
UNE-EN 140401:2009 Identical
NBN EN 140401 : 2009 Identical
BS EN 140401:2009 Identical
SN EN 140401 : 2009 Identical
CEI EN 140401 : 2009 Identical

06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
BS EN 140401-801 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
06/30155905 DC : DRAFT SEP 2006 BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
I.S. EN 140401-804:2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
BS EN 140401-804 : 2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
EN 140401-804:2011/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
I.S. EN 140401-801:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
EN 140401-801:2007/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1

IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
EN 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
CECC 240001 : 1996 FIXED LOW POWER FILM RESISTORS (LEADED/UNLEADED)
EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
IEC 60286-2:2015 Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 60027-1:2006/A2:2007 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 1: GENERAL
EN 60286-2:2015 Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
EN 140400:2003 Sectional specification: Fixed low power surface mount (SMD) resistors
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
EN 61193-2 : 2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC TR 60440:1973 Method of measurement of non-linearity in resistors
EN 61340-3-1:2007 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
IEC 60062:2016 Marking codes for resistors and capacitors
EN 60062:2016/AC:2016-12 MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
IEC 61340-3-1:2006 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
EN 60068-2-13:1999 Environmental testing - Part 2: Tests - Test M: Low air pressure
EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
IEC 60063:2015 Preferred number series for resistors and capacitors
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60286-1:2017 Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
EN 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
EN 60695-11-5:2017 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
IEC 60695-11-5:2016 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
IEC 60195:2016 Method of measurement of current noise generated in fixed resistors
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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