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EN 190000:1995

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Generic Specification: Monolithic integrated circuits
Withdrawn date

11-01-2004

Published date

21-06-1995

Foreword
Preface
1 Scope
2 General
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.3.1 General
2.3.2 General terms for integrated circuits
2.4 Standard and preferred values
2.5 Marking of component and package
2.5.1 Terminal identification
2.5.2 Factory identification code
2.5.3 Precautions for Electrostatic Sensitive Devices
2.5.4 Optional tests
2.5.5 Marking symbols location
2.6 Ordering information
3 Quality assessment procedures
3.1 Primary stage of manufacture and subcontracting
3.2 Structural similarity procedures
3.2.1 General rules
3.2.2 Test dependent criteria for structural similarity
3.3 Qualification approval procedure
3.3.1 Definition of production lot and inspection lot
3.3.2 Approval procedure
3.3.3 Major alterations
3.3.4 Examples of major alterations
3.4 Quality conformance inspection
3.4.1 Division into Groups and Sub-Groups
3.4.2 Quality inspection testing
3.4.3 Sampling procedures for small lots
3.4.4 Supplementary procedure for reduced inspection
3.4.5 Re-submission of rejected lots
3.4.6 Certified test records
3.4.7 Delayed delivery
3.4.8 Delivery of devices subjected to destructive
        or non-destructive tests
3.4.9 Supplementary procedure for deliveries
3.4.10 Supplementary information
3.5 Capability Approval
3.6 Inspection requirements
3.7 Statistical Process Control (SPC)
4 Test and measurement procedures
4.1 Standard conditions for testing
4.1.1 Standard atmospheric conditions for reference
4.1.2 Standard atmospheric conditions for referee tests
4.1.3 Standard atmospheric conditions for testing
4.1.4 Standard atmospheric conditions for electrical
        measurements
4.1.5 Standard recovery conditions
4.2 Visual examination
4.2.1 Internal visual examination (pre-cap inspection)
4.2.2 External visual examination
4.3 Dimensions
4.4 Immersion in cleaning solvents
4.5 Electrical measurement procedure
4.5.1 Ratings
4.5.2 Equilibrium conditions
4.5.3 Temperature
4.5.4 Precautions
4.5.5 Measurement circuit requirements
4.5.6 Multiple integrated circuits
4.5.7 Unspecified connections to terminals
4.5.8 Electrical measuring methods
4.5.9 Transient energy test
4.5.10 Correlated measurements
4.5.11 Die attach
4.5.12 Latch-up
4.6 Environmental testing procedures
4.6.1 Storage at high and low temperatures
4.6.2 Damp heat, steady-state
4.6.3 Damp heat
4.6.4 Shock
4.6.5 Vibrations (sinusoidal)
4.6.6 Vibration, fixed frequency
4.6.7 Acceleration, steady-state
4.6.8 Change of temperature
4.6.9 Sealing
4.6.10 Solderability of terminations
4.6.11 Resistance of components to soldering heat
4.6.12 Robustness of terminations and integral
        mounting devices
4.6.13 Industrial atmosphere
4.6.14 Salt mist
4.6.15 Flammability test of plastic encapsulated devices
4.6.16 Moisture induced cracking test
4.6.17 Internal wire pull test
4.6.18 Die shear strength test
4.7 Definition of axes for mechanical tests
4.8 Electrical endurance testing
4.8.1 General conditions
4.8.2 Test temperature and duration
4.8.3 Operating modes and specific conditions for
        testing
4.8.4 Initial and end point tests
4.9 Accelerated test procedures
4.9.1 Requirements for elegibility in periodic testing
4.9.2 Thermally accelerated electrical endurance
        testing
4.9.3 Level of activation energy for thermally
        accelerated tests
4.10 Screening
4.10.1 Screening procedures
4.10.2 Screens and tests description
4.10.3 Specified conditions
Annex A: Internal visual examination and alternate method
Annex B: Comparison between IEC and CECC documents
(environmental and endurance testing procedures)
Annex C: Capability approval
Annex D: CQC specification writer's guide
Annex E: Guide for application of structural similarity
procedures described in clause 3.2
Annex F: Statistical process control (SPC)
Annex G: EQML for integrated circuits

This specification specifies the terms, definitions, symbols, test methods and other material for monolithic integrated (micro)circuits (*), as defined in IEC 747, necessary to prepare appropriate detail sepcifications (DS) in the CECC System. Supplementary requirements for different families of integrated microcircuits are included in separate specifications. (*) In the following term "integrated circuits" is used.

Committee
CLC/SR 47A
DevelopmentNote
Supersedes CECC 90000 (05/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn
Supersedes

Standards Relationship
DS EN 190000 : 1997 Identical
NEN EN 190000 : 1995 Identical
SN EN 190000 : 1995 Identical
PN EN 190000 : 2002 Identical
I.S. EN 190000:1996 Identical
NF EN 190000 : 2013 Identical
BS EN 190000:1996 Identical
DIN EN 190000:1996-05 Identical
UNE-EN 190000:1992 Identical
NBN EN 190000 : 2008 Identical

13/30286159 DC : 0 BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
13/30286163 DC : 0 BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
13/30286167 DC : 0 BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES
DD IEC/TS 62239:2003 Process management for avionics. Preparation of an electronic components management plan
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
EN 166100:1998 Sectional Specification: Surface acoustic wave (SAW) filters
CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
UTEC 96 029 : 2011 ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
02/203838 DC : DRAFT MAR 2002
I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
IEC TS 62239:2008 Process management for avionics - Preparation of an electronic components management plan
CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
IEC PAS 62239:2001 Electronic component management plans
IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
BS EN 166100:1998 Harmonized system of quality assessment for electronic components. Sectional specification:surface acoustic wave (SAW) filters
BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
17/30365636 DC : 0 BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
PD IEC/TS 62239-1:2015 Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
DD CLC/TS 50466:2006 Long duration storage of electronic components. Specification for implementation
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

BS 5555:1993 Specification for SI units and recommendations for the use of their multiples and of certain other units
BS EN 100114-6:1997 CECC Quality assessment procedure for electronic components Technology approval of electronic component manufacturers
IEC 60134:1961 Rating systems for electronic tubes and valves and analogous semiconductor devices
BS E9007:1975 Specification for harmonized system of quality assessment for electronic components: Basic specification: Sampling plans and procedures for inspection by attributes
BS 6493-1.1:1984 Semiconductor devices. Discrete devices General
BS 6493-2.1:1985 Semiconductor devices. Integrated circuits General
IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
BS 6493-3:1985 Semiconductor devices Mechanical and climatic test methods
BS 6493-2.4(1989) : 1989 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - RECOMMENDATIONS INTERFACE INTEGRATED CIRCUITS
BS 6493-2.2(1986) : 1986 SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - RECOMMENDATIONS FOR DIGITAL INTEGRATED CIRCUITS
BS 4727(1971) : LATEST
BS EN 100114-1:1997 Rule of Procedure 14. Quality assessment procedures CECC requirements for the approval of an organization
DD ENV 190000-6:1994 Generic specification: monolithic integrated circuits Procedure for approval and quality management
BS 3934:1965 Specification for dimensions of semiconductor devices and integrated electronic circuits
BS 2011(1967) : LATEST
BS 6493-2.3:1987 Semiconductor devices. Integrated circuits Recommendations for analogue integrated circuits
BS QC700000(1991) : 1991 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRIC COMPONENTS - GENERIC SPECIFICATION FOR DISCRETE DEVICES AND INTEGRATED CIRCUITS
BS EN 60617-13:1993 Graphical symbols for diagrams Analogue elements

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