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EN 60191-6-17:2011

Current
Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Published date

15-04-2011

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Terminal position numbering
5 Drawings
6 Dimensions
7 Dimension table
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Committee
CLC/SR 47D
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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