Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Published date

15-02-2002

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
  pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
  1,00 mm pitch
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

Committee	CLC/SR 47D
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
UNE-EN 60191-6-2:2003	Identical
NBN EN 60191 6-2 : 2002	Identical
I.S. EN 60191-6-2:2002	Identical
NEN EN IEC 60191-6-2 : 2002	Identical
CEI EN 60191-6-2 : 2002	Identical
PN EN 60191-6-2 : 2003	Identical
NF EN 60191-6-2 : 2002	Identical
DIN EN 60191-6-2:2002-09	Identical
IEC 60191-6-2:2001	Identical
BS EN 60191-6-2:2002	Identical

BS EN 60191-6-18:2010	Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
EN 60191-6-18:2010	Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
EN 62137:2004/corrigendum:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
BS EN 60191-6-19:2010	Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
BS EN 62137:2004	Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
CEI EN 60191-6-19 : 2011	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
I.S. EN 62137:2005	ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
BS EN 62137-4:2014	Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
I.S. EN 62137-4:2014	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
I.S. EN 60191-6-19:2010	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
EN 60191-6-19:2010	Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
EN 62137-4:2014/AC:2015	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)