Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Published date

03-04-2003

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance (for guidance)
8 Detail specification
9 Summary
Bibliography

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Committee	CLC/SR 47
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NF EN 60749-16 : 2003	Identical
IEC 60749-16:2003	Identical
NBN EN 60749-16 : 2004	Identical
NEN EN IEC 60749-16 : 2003	Identical
I.S. EN 60749-16:2003	Identical
PN EN 60749-16 : 2005	Identical
UNE-EN 60749-16:2003	Identical
BS EN 60749-16:2003	Identical
CEI EN 60749-16 : 2005	Identical
DIN EN 60749-16:2003-09	Identical

IEC 61340-5-1:2016

Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements

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EN 60749-16:2003

Current

Table of Contents

Abstract

General Product Information

International Equivalents

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