EN 60749-5:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
07-07-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Equipment
6 Test conditions
7 Procedures
8 Failure criteria
9 Safety
10 Summary
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
IEC 60749-5:2017(E) provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.This edition includes the following significant technical changes with respect to the previous edition:a) correction of an error in an equation;b) inclusion of notes for guidance;c) clarification of the applicability of test conditions.
| Committee |
CLC/SR 47
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-5:2017 | Identical |
| NF EN 60749-5 : 2003 | Identical |
| UNE-EN 60749-5:2003 | Identical |
| NBN EN 60749-5 : 2004 | Identical |
| NEN EN IEC 60749-5 : 2017 | Identical |
| I.S. EN 60749-5:2017 | Identical |
| SN EN 60749-5 : 2003 | Identical |
| UNE-EN 60749-5:2017 | Identical |
| NF EN 60749-5:2017 | Identical |
| BS EN 60749-5:2017 | Identical |
| CEI EN 60749-5 : 2005 | Identical |
| DIN EN 60749-5:2003-09 | Identical |
| DS EN 60749-5 : 2017 | Identical |
| PN EN 60749-5 : 2017 | Identical |
| I.S. EN 60749-4:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| BS EN 60749-30 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| CEI EN 60749-24 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST |
| BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
| BS EN 60749-4:2017 | Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST) |
| EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| BS EN 62047-5:2011 | Semiconductor devices. Micro-electromechanical devices RF MEMS switches |
| BS EN 60749-24:2004 | Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| I.S. EN 62047-5:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
| I.S. EN 60749-30:2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| CEI EN 60749-4 : 2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
| I.S. EN 60749-24:2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST |
| EN 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
| EN 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| EN 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
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