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EN 61163-1 : 2006

Current
Current

The latest, up-to-date edition.

RELIABILITY STRESS SCREENING - PART 1: REPAIRABLE ASSEMBLIES MANUFACTURED IN LOTS
Published date

01-12-2006

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols
5 General description
  5.1 The reliability stress screening principle
  5.2 Failure categories
  5.3 Time of occurrence of failures
6 Planning
  6.1 Stress conditioning
  6.2 Evaluation of the failure-free period T[M]
  6.3 Time graphs for determination of the failure-free period
7 Pilot-production screening
  7.1 General
  7.2 Collection of information
  7.3 Evaluation of information
  7.4 Re-evaluating the failure-free period T[M]
8 Mature production screening
  8.1 General
  8.2 Collection of information
  8.3 Evaluation of information
  8.4 Dealing with discrepancies
  8.5 Eliminating reliability stress screening
Annex A (informative) Stress conditions - General information
Annex B (informative) Stress conditions - Temperature
Annex C (informative) Stress conditions - Vibration and bump
Annex D (informative) Stress conditions - Humidity
Annex E (informative) Stress conditions - Operational stress
Annex F (informative) Voltage stress
Annex G (informative) Highly accelerated stress screening
Annex H (informative) Bimodal distributions - Weibull plotting
                      and analysis
Annex I (informative) Evaluation of the failure-free period
                      and the average screening duration
Annex J (informative) Worked example
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications
Bibliography

Describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.

Committee
SR 56
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

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IEC 61649:2008 Weibull analysis
IEC 61014:2003 Programmes for reliability growth
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
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IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60300-2:2004 Dependability management - Part 2: Guidelines for dependability management
EN 60068-2-29:1993 Environmental testing - Part 2: Tests - Test Eb and guidance: Bump
EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
IEC 60068-2-29:1987 Environmental testing. Part 2: Tests. Test Eb and guidance: Bump
EN 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
EN 60300-2:2004 Dependability management - Part 2: Guidelines for dependability management
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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