Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Published date

20-09-2006

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
  4.1 Method of gripping
  4.2 Method of loading
  4.3 Speed of testing
  4.4 Force measurement
  4.5 Elongation measurement
  4.6 Stress-strain curve
  4.7 Environment control
5 Test piece
  5.1 General
  5.2 Plane shape of test piece
  5.3 Test piece thickness
  5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Committee	CLC/SR 47
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NEN EN IEC 62047-2 : 2006	Identical
NF EN 62047-2 : 2006	Identical
NBN EN 62047-2 : 2007	Identical
I.S. EN 62047-2:2006	Identical
UNE-EN 62047-2:2006	Identical
BS EN 62047-2:2006	Identical
PN EN 62047-2 : 2006	Identical
IEC 62047-2:2006	Identical
CEI EN 62047-2 : 2007	Identical
DIN EN 62047-2:2007-02	Identical

I.S. EN 62047-17:2015	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
I.S. EN 62047-13:2012	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES (IEC 62047-13:2012 (EQV))
I.S. EN 62047-3:2006	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
EN 62047-13:2012	Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
BS EN 62047-22:2014	Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
BS EN 62047-17:2015	Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
BS EN 62047-9:2011	Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
CEI EN 62047-13 : 2013	SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
CEI EN 62047-3 : 2007	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
BS EN 62047-6:2010	Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials
BS EN 62047-13:2012	Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
BS EN 62047-8:2011	Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
BS EN 62047-3:2006	Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
I.S. EN 62047-6:2010	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS
CEI EN 62047-6 : 2011	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS
CEI EN 62047-17 : 2016	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
EN 62047-17:2015	Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
EN 62047-22:2014	Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
I.S. EN 62047-22:2014	SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
EN 62047-9:2011	Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-3 : 2006	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
EN 62047-6:2010	Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

ISO 6892:1998

Metallic materials Tensile testing at ambient temperature

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EN 62047-2:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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