1 Scope
2 Normative references
3 Definitions
4 Default test environment and conditioning
5 Test methods
  5.1 Card warpage
  5.2 Dimensions of cards
  5.3 Embossing relief height of character
  5.4 Height and surface profile of the magnetic stripe
  5.5 Surface roughness of the magnetic stripe
  5.6 Wear test for magnetic stripe
  5.7 Delamination
  5.8 Resistance to chemicals
  5.9 Amplitude measurements
  5.10 Card dimensional stability and warpage with temperature
       and humidity
  5.11 Adhesion or blocking
  5.12 Bending stiffness
  5.13 Flammability
  5.14 Light transmittance
  5.15 Flux transition spacing variation
6 Test methods of the integrated circuit card
  6.1 Dynamic bending stress (bending properties)
  6.2 Dynamic torsion stress (torsion)
  6.3 Location of contacts
  6.4 Static electricity
  6.5 Ultraviolet light
  6.6 X-rays
  6.7 Electrical resistance and impedance of contacts
  6.8 Surface profile contacts
  6.9 Vibrations
  6.10 Electromagnetic fields