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SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Letter symbols
5 Essential ratings (limiting values) and
  characteristics
6 Measurement methods
7 Acceptance and reliability
Annex A (informative) - Test method of peak case
        non-rupture current
Annex B (informative) - Measuring method of the
        thickness of thermal compound paste
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	31
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
DIN EN 60747-15:2012-08	Identical
NBN EN 60747-15 : 2012	Identical
BS EN 60747-15:2012	Identical
EN 60747-15:2012	Identical
NF EN 60747-15 : 2013	Identical

IEC 60112:2003+AMD1:2009 CSV	Method for the determination of the proof and the comparative tracking indices of solid insulating materials
IEC 60270:2000+AMD1:2015 CSV	High-voltage test techniques - Partial discharge measurements
IEC 60747-7:2010	Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
IEC 61287-1:2014	Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods
EN 60749-15:2010/AC:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
IEC 60749-21:2011	Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-34:2010	Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
EN 60270:2001/A1:2016	HIGH-VOLTAGE TEST TECHNIQUES - PARTIAL DISCHARGE MEASUREMENTS (IEC 60270:2000/A1:2015)
EN 60749-5:2017	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60747-9:2007	Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)
EN 60749-21:2011	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
IEC 60747-8:2010	Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
IEC 60749-15:2010	Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
EN 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
EN 60664-1:2007	Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 60747-1:2006+AMD1:2010 CSV	Semiconductor devices - Part 1: General
IEC 60749-34:2010	Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV	Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
EN 60749-6:2017	Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-10:2002	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60747-6:2016	Semiconductor devices - Part 6: Discrete devices - Thyristors
EN 60749-25:2003	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60664-1:2007	Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 60747-2:2016	Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
IEC 60749-12:2002	Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
EN 60749-12:2002	Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
EN 60721-3-3 : 95 AMD 2 97	CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STATIONARY USE AT WEATHER-PROTECTED LOCATIONS

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I.S. EN 60747-15:2012

SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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