I.S. EN 60749-14:2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
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