SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2017

Publisher

National Standards Authority of Ireland

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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Summary
Bibliography

Defines the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	20
PublisherName	National Standards Authority of Ireland
Status	Current

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-43:2017	Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

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Table of Contents

Abstract