PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 QFJ (square)
  4.1 Introductory remark
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 QFJ (rectangular)
  5.1 Introductory remark
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
Bibliography

Covers information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	51
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 61188-5-6:2003	Identical
NF EN 61188-5-6 : 2003	Identical
BS EN 61188-5-6:2003	Identical
DIN EN 61188-5-6:2003-10	Identical
IEC 61188-5-6:2003	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IPC SM 782 : A1993 AMD 2 1999	SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

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I.S. EN 61188-5-6:2003

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory

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