I.S. EN 61191-6:2010
Current
The latest, up-to-date edition.
PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
Hardcopy , PDF
English
01-01-2010
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
5 Measurement
6 Void occupancy
7 Evaluation
Annex A (informative) - Experimental results and simulation of
voids and decrease of life due to thermal stress
Annex B (informative) - X-ray transmission equipment
Annex C (informative) - Voids in BGA solder ball
Annex D (informative) - Measurement using X-ray transmission
imaging
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
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