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I.S. EN 61760-1:2006

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
Available format(s)

Hardcopy , PDF

Superseded date

29-10-2020

Language(s)

English

Published date

01-01-2006

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope and object
  1.1 Scope
  1.2 Object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component
  specifications
  4.1 General requirement
  4.2 Packaging
  4.3 Labelling of product packaging
  4.4 Component marking
  4.5 Storage and transportation
  4.6 Component outline and design
  4.7 Mechanical stress
  4.8 Component reliability assurance
  4.9 Additional requirements for compatibility with
      lead-free soldering
5 Specification of assembly process conditions
  5.1 General
  5.2 Securing the component on the substrate prior
      to soldering
  5.3 Mounting methods
  5.4 Cleaning (where applicable)
  5.5 Removal and/or replacement of SMDs
6 Typical process conditions
  6.1 Soldering processes, temperature/time profiles
  6.2 Typical cleaning conditions for assemblies
7 Requirements for components and component specifications
  related to suitability with various mounting processes
  7.1 General
  7.2 Wettability
  7.3 Resistance to dissolution of metallization
  7.4 Resistance to soldering heat
  7.5 Resistance to cleaning solvent
  7.6 Soldering profiles
  7.7 Bonding strength test for the component glue interface
      test
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications
Bibliography

Defines set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

DevelopmentNote
Supersedes I.S. 1116. (01/2012) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
42
PublisherName
National Standards Authority of Ireland
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
DIN EN 61760-1:2006-10 Identical
BS EN 61760-1:2006 Identical
NBN EN 61760-1 : 2007 Identical
IEC 61760-1:2006 Identical
SN EN 61760-1 : 1998 Identical
NF EN 61760-1 : 2014 Identical
EN 61760-1:2006 Identical

EN 60286-5:2004/A1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
EN 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 61340-5-3:2015 Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60749 : 99 AMD 2 2001 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS
IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
EN 62090:2017 Product package labels for electronic components using bar code and two- dimensional symbologies
IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
ISO 8601:2004 Data elements and interchange formats Information interchange Representation of dates and times
IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60062:2016 Marking codes for resistors and capacitors
EN 60062:2016/AC:2016-12 MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
EN 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions

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