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I.S. EN 62047-11:2013

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013 (EQV))
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2013

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative References
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Test piece fabrication
Annex B (informative) - Test piece handling example
Annex C (informative) - Test piece releasing process
Annex D (informative) - Out-of-plane test setup
        and test piece example
Annex E (informative) - Data analysis example in
        in-plane test method
Annex F (informative) - Data analysis example in
        out-of-plane test method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 [mu]m and 1 mm and thickness between 0,1 [mu]m and 1 mm, which are main structural materials used for MEMS, micromachines and others.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
25
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62047-11 : 2013 Identical

ASTM E 228 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
ASTM E 289 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry

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