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I.S. EN 62435-2:2017

Current
Current

The latest, up-to-date edition.

ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2017

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of deterioration
5 Technical validation of the components
Annex A (normative) - Failure mechanisms - Encapsulated and
        non-encapsulated active components
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (06/2017)
DocumentType
Standard
Pages
50
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62435-2:2017 Identical

IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
IEC TS 61945:2000 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 60721-3-1:1997 Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage
EN 190000:1995 Generic Specification: Monolithic integrated circuits

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Hardcopy - English
PDF - English
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