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I.S. EN 62435-5:2017

Current
Current

The latest, up-to-date edition.

ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2017

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Storage requirements
5 Long-term storage failure mechanisms
6 LTS concerns, method, verification and limitations
7 Deterioration mechanisms specific to bare die and wafers
8 Specific handling concerns
Annex A (informative) - Audit checklist
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Pertains to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (05/2017)
DocumentType
Standard
Pages
56
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62435-5:2017 Identical

IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC TS 61945:2000 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
IEC 61340-2-1:2015 Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge
IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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