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IEC 60115-8-1:2014

Current
Current

The latest, up-to-date edition.

Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

17-10-2014

FOREWORD
0 Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Characteristics and ratings
5 Tests and test severities
6 Performance requirements
7 Marking, packaging and ordering information
8 Additional information
9 Quality assessment procedures
Annex A (normative) - 0 [omega] resistors (jumper)
Annex B (informative) - Letter symbols and abbreviations
Annex X (informative) - Cross-reference for references to
        the prior revision of this specification
Bibliography

IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition:
- It includes minor revisions related to tables, figures and references.
- Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals.
- Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules.
- Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic.
- Adition of a test for the immunity against electrostatic discharge.
- Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests.
- Addition of information relevant for the component user in his assembly process.
- Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.

DevelopmentNote
Stability Date: 2019. (10/2012)
DocumentType
Standard
Pages
89
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
NEN EN IEC 60115-8-1 : 2015 Identical
NF EN 60115-8-1 : 2016 Identical
PN EN 60115-8-1 : 2015 Identical
UNE-EN 60115-8-1:2015 Identical

IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC Q 03-3 : 2.1 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
IEC 60286-6:2004 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
IEC Q 03-3-1 : 1ED 2013 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3-1: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT-TECHNOLOGY CERTIFICATION (IECQ AC-TC)
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60062:2016 Marking codes for resistors and capacitors
IEC 61340-3-1:2006 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
IEC 60063:2015 Preferred number series for resistors and capacitors
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60060-1:2010 High-voltage test techniques - Part 1: General definitions and test requirements
IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
IEC 60695-11-5:2016 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60440:2012 Method of measurement of non-linearity in resistors
IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
IEC 60195:2016 Method of measurement of current noise generated in fixed resistors
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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