Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

27-09-2016

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Socket code
5 Terminal number
6 Socket nominal dimension
7 Socket length and width
8 Reference symbols and schematics
9 Individual outline drawing standard registration

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

Committee	TC 47/SC 47D
DevelopmentNote	Stability Date: 2020. (09/2016)
DocumentType	Standard
Pages	36
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC 60191-6-13:2007

Standards	Relationship
DIN EN 60191-6-13:2013-07 (Draft)	Identical
NF EN 60191-6-13 : 2017	Identical
NEN EN IEC 60191-6-13 : 2016	Identical
PN EN 60191-6-13 : 2017	Identical
SN EN 60191-6-13:2016	Identical
UNE-EN 60191-6-13:2016	Identical
BS EN 60191-6-13:2016	Identical
CEI EN 60191-6-13 : 2009	Identical
EN 60191-6-13:2016	Identical

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-2:2012 DB	Mechanical standardization of semiconductor devices - Part 2: Dimensions

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IEC 60191-6-13:2016

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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Abstract

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