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IEC 60249-3-3:1991

IEC 60249-3-3:1991

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English - French

Published date

04-06-1991

Publisher

International Electrotechnical Committee

FOREWORD
Clause
1 Scope
2 Normative references
3 Terms and definitions
4 Solder resist material properties evaluation
5 Solder resist system evaluation
6 Dimensions, quantities and tolerances of the materials
    as purchased
7 Packaging
8 Marking of containers
9 Storage properties
ANNEX A (normative) - Test methods
Annex B (informative) - Test methods summary

Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board.Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser.Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.

DevelopmentNote
Also numbered as BS 4584-103.3(1992) (08/2005)
DocumentType
Standard
Pages
37
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
DIN IEC 60249-3-3:1994-06 Identical

I.S. EN 60249-2-1:1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS SPECIFICATION NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY
I.S. EN 60249-2-2:1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY
I.S. EN 60249-2-14:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY
EN 60249-2-14 : 1994 AMD 5 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY
EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
BS 4584-15:1978 Metal-clad base materials for printed wiring boards Adhesive coated polymeric films: PETP-F-15 and PI-F-15
I.S. EN 60249-2-15:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY
I.S. EN 60249-2-11:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
BS EN 60249-2-18:1993 Specifications Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
BS EN 60249-2-17:1993 Specifications Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
I.S. EN 60249-2-13:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
I.S. EN 60249-2-12:1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
BS EN 115:1995 Safety rules for the construction and installation of escalators and passenger conveyors.
EN 60249-2-12 : 1994 AMD 4 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
EN 60249-2-11 : 1994 AMD 4 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
EN 60249-2-8 : 1994 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM
EN 60249-2-10 : 1994 AMD 5 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
EN 60249-2-15 : 1994 AMD 1 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY
EN 60249-2-2 : 1994 AMD 5 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY
EN 60249-2-9 : 1994 AMD 5 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACES COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
NF EN 62326 4-1 : 1998 PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C
05/30133451 DC : 0 EN 115 - SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF ESCALATORS AND MOVING WALKS
I.S. EN 60249-2-10:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
I.S. EN 60249-2-9:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACES COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
BS EN 60249-2-16:1993 Specifications Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
I.S. EN 60249-2-8:1995 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM
EN 115:1995/A2:2004 SAFETY RULES FOR THE CONSTRUCTION & INSTALLATION OF ESCALATORS & PASSENGER CONVEYORS
EN 60249-2-13 : 1994 AMD 1 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
EN 60249-2-1 : 1994 AMD 4 2000 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET - HIGH ELECTRICAL QUALITY

IEC 60112:2003+AMD1:2009 CSV Method for the determination of the proof and the comparative tracking indices of solid insulating materials
IEC 60250:1969 Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60249-2-5:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60426:2007 Electrical insulating materials - Determination of electrolytic corrosion caused by insulating materials - Test methods
IEC 60249-2-7:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
ISO 2409:2013 Paints and varnishes Cross-cut test
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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