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IEC 60747-5-6:2016

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

31-12-2021

Language(s)

English - French

Published date

23-02-2016

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Absolute maximum ratings
5 Electrical and optical characteristics
6 Measuring method
7 Items to be indicated on the package
8 Quality evaluation
Annex A (normative) - Standard luminous efficiency
Annex B (normative) - How to obtain the self-absorption
        correction factor
Annex C (normative) - How to obtain the colour
        correction factor
Annex D (normative) - Calibration of the luminance
        meter
Annex E (normative) - Colour-matching function of
        the XYZ colour system
Annex F (normative) - Spectral chromaticity coordinates
Annex G (normative) - Illuminometer calibration
Bibliography

IEC 60747-5-6:2016 specifies the terminology, the essential ratings and characteristics, the measuring methods and the quality evaluations of light emitting diodes (LEDs) for general industrial applications such as signals, controllers, sensors, etc. LEDs for lighting applications are out of the scope of this part of IEC 60747. The types of LED are divided into the following five classes:
a) LED package;
b) LED flat illuminator;
c) LED numeric display and alpha-numeric display;
d) LED dot-matrix display;
e) I LED (infrared-emitting diode).
LEDs with a heat spreader or having a terminal geometry that performs the function of a heat spreader are within the scope of this part of IEC 60747. An integration of LEDs and controlgears, integrated LED modules, semi-integrated LED modules, integrated LED lamps or semi-integrated LED lamps, are out of the scope of this part of IEC 60747. This first edition of IEC 60747-5-6, together with IEC 60747-5-4, IEC 60747-5-5 and IEC 60747-5-7, cancels and replaces IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, published in 1997, and their amendments. This edition constitutes a technical revision. This edition includes significant technical changes to the clauses for light emitting diodes in IEC 60747-5-1:1997, IEC 60747-5-2:1997 and IEC 60747-5-3:1997, including their amendments.

Committee
TC 47/SC 47E
DevelopmentNote
Supersedes IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3. Stability date: 2018. (02/2016)
DocumentType
Standard
Pages
168
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
ISO 2859:1974 Sampling procedures and tables for inspection by attributes
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC 60050-845:1987 International Electrotechnical Vocabulary (IEV) - Part 845: Lighting
IEC 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 62504:2014 General lighting - Light emitting diode (LED) products and related equipment - Terms and definitions
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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