Contents
Foreword
Clause
Chapter I: General
1. Scope
2. Normative references
Chapter II: Terminology and Letter Symbols
1. Terminology for combinatorial and sequential
    integrated circuits
2. Examples
3. Terminology for integrated circuit memories
4. Terminology for integrated circuit microprocessors
5. Terminology for charge-transfer devices
6. Letter symbols for combinatorial and sequential
    circuits
7. Letter symbols for the dynamic parameters of
    sequential integrated circuits, including memories
8. Additional terms and definitions for digital integrated
    circuits
9. Classification of programmable logic devices (PLDs)
Chapter III: Essential Ratings and Characteristics
Section One - Digital Integrated Circuits, General
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Recommended operating conditions (within the specified
    operating temperature range)
5. Static electrical characteristics for bipolar integrated
    circuits
6. Static and quasi-static electrical characteristics for
    MOS integrated circuits
7. Dynamic electrical characteristics
8. Total power or currents provided from the supplies
9. Total current drawn from the power supplies (dynamic
    operation)
10. Command pulse information (where appropriate)
11. Insulation resistance
12. Mechanical ratings, characteristics and other data
13. Supplementary information
14. Handling precautions
Appendix to Section One - Specification of characteristics
Section Two - Integrated Circuit Memories
A. Static and dynamic read/write memories and read/only
    memories
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Recommended operating conditions (within the specified
    operating temperature range)
5. Static electrical characteristics for bipolar memories
6. Static electrical characteristics for MOS memories
7. Dynamic electrical characteristics
8. Power or current drawn from each supply (static
    operation)
9. Power or current drawn from each supply (dynamic
    operation)
10. Mechanical ratings, characteristics and other data
11. Supplementary information
12. Handling precautions
B. Field-programmable read-only memories
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Read mode
5. Programming mode
6. Erasing mode (if applicable)
7. Number of programming-erasing cycles
8. Data retention information
9. Power or current drawn from each supply (static
    operation)
10. Power or current drawn from each supply (dynamic
    operation)
11. Mechanical ratings, characteristics and other data
12. Supplementary information
13. Handling precautions
C. Content addressable memories (CAM)
1. Circuit identification and description
2. Functional specifications
3. The provisions of clauses 3 to 6 of Section Two A apply
4. The provisions of clauses 7 and 7.1 of Section Two A
    apply with the exception of 7.1.1 which is replaced by
    the following
5. The provisions of 7.2 and 7.3 of Section Two A apply
6. The provisions of clauses 8 to 12 of Section Two A apply
Section Three - Integrated Circuit Microprocessors
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Recommended operating conditions (within the specified
    operating temperature range)
5. Electrical characteristics
6. Mechanical ratings, characteristics and other data
7. Supplementary information
8. Handling precautions
Section Four - Programmable Logic Devices (PLDs)
1. Circuit identification and types
2. Application related description
3. Specification of the function
4. Limiting values (absolute maximum rating system)
5. Recommended operating conditions (within the specified
    operating temperature range)
6. Electrical characteristics
7. Programming
8. Design aspects
9. Mechanical and environment rating, characteristics and
    data
10. Additional information
Chapter IV: Measuring Methods
Section One - General
1. Basic requirements
2. Specific requirements
3. Application matrix for the measuring methods
Section Two - Measuring Methods of static Characteristics
1. High-level and low-level output voltages (VOH and VOL)
    37
2. High-level and low-level input currents (/IH and /IL)
    38
3. Short-circuit output current (/OS) 40
4. Power supply current under static conditions 41
5. (Input) threshold voltages and hysteresis voltage 48
6. Input clamping voltage (VIK) 94
7. Off-state output current (/OZ) 95
8. Latch-up characteristics 96
Section Three - Dynamic Measurements
1. Total current drawn from the power supplies under
    dynamic conditions
2. Power supplied through the clock line 2
3. Input and output impedances 6, 11
4. Times characterizing the circuit
5. Switching frequency of a sequential circuit 10
6. Method of verification of the function of a digital
    integrated circuit 97
Chapter V: Acceptance and Reliability
Section One - Electrical Endurance Tests
1. General requirements
2. Specific requirements
Table 7