Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

17-01-2003

Publisher

International Electrotechnical Committee

Foreword
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance (for guidance)
8 Detail specification
9 Summary
Bibliography

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Committee	TC 47
DevelopmentNote	Supersedes IEC PAS 62171 (04/2003) Stability Date: 2019. (11/2017)
DocumentType	Standard
Pages	13
PublisherName	International Electrotechnical Committee
Status	Current
Supersedes	IEC PAS 62171:2000

Standards	Relationship
NF EN 60749-16 : 2003	Identical
NEN EN IEC 60749-16 : 2003	Identical
I.S. EN 60749-16:2003	Identical
PN EN 60749-16 : 2005	Identical
UNE-EN 60749-16:2003	Identical
CEI EN 60749-16 : 2005	Identical
EN 60749-16:2003	Identical
DIN EN 60749-16:2003-09	Identical
BS EN 60749-16:2003	Identical

13/30264591 DC : 0	BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
13/30264600 DC : 0	BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
13/30264596 DC : 0	BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER

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IEC 60749-16:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Category

Subcategory