IEC 60749-21:2011
Current
The latest, up-to-date edition.
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
07-04-2011
FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary
Bibliography
IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.
This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62173. (03/2004) Supersedes IEC 60749. (03/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NBN EN 60749-21 : 2011 | Identical |
| NEN EN IEC 60749-21 : 2011 | Identical |
| PN EN 60749-21 : 2011 | Identical |
| BS EN 60749-21:2011 | Identical |
| CEI EN 60749-21 : 2012 | Identical |
| EN 60749-21:2011 | Identical |
| DIN EN 60749-21:2012-01 | Identical |
| UNE-EN 60749-21:2011 | Identical |
| I.S. EN 60749-21:2011 | Identical |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
| BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| 15/30269562 DC : 0 | BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC 60747-15:2010 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| IEC 60747-5-6:2016 | Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes |
| IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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