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IEC 60749-28:2017

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

01-03-2022

Language(s)

English, English - French

Published date

28-03-2017

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Required equipment
5 Periodic tester qualification, waveform records,
  and waveform verification requirements
6 CDM ESD testing requirements and procedures
7 CDM classification criteria
Annex A (normative) - Verification module (metal
        disc) specifications and cleaning guidelines for
        verification modules and testers
Annex B (normative) - Capacitance measurement
        of verification modules (metal discs) sitting on
        a tester field plate dielectric
Annex C (informative) - CDM test hardware and
        metrology improvements
Annex D (informative) - CDM tester electrical
        schematic
Annex E (informative) - Sample oscilloscope setup
        and waveform
Annex F (informative) - Field-induced CDM tester
        discharge procedures
Annex G (informative) - Waveform verification
        procedures
Annex H (informative) - Determining the appropriate
        charge delay for full charging of a large module
        or device
Annex I (informative) - Electrostatic discharge (ESD)
        sensitivity testing direct contact charged device
        model (DC-CDM)
Bibliography

IEC 60749-28:2017(E) establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex I.
The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.

Committee
TC 47
DevelopmentNote
Stability Date: 2021. (03/2017)
DocumentType
Standard
Pages
44
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

BS EN 62575-1:2016 Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality Generic specification
BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
I.S. EN 62575-1:2016 RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
EN 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
BS EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality Generic specification
EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
IEC 62615:2010 Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level
IEC 62575-1:2015 Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification
BS EN 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality Generic specification
15/30269562 DC : 0 BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS
CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
IEC 62604-1:2015 Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
IEC 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
BS IEC 62615:2010 Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
I.S. EN 62604-1:2015 SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
I.S. EN 60862-1:2015 SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
EN 62575-1:2016 Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification

IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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Hardcopy - English
PDF - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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