We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
  • IEC 60749-30:2005+AMD1:2011 CSV

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
    Add to Watchlist
    This Standard has been added successfully to your Watchlist.
    Please visit My Watchlist to see all standards that you are watching.
    Please log in or to add this standard to your Watchlist.
    We could not add this standard to your Watchlist.
    Please retry or contact support for assistance.
    You need to be logged in to add this standard to your Watchlist.
    Please log in now or create an account to add.
    You already added this Product in the Watchlist.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  26-08-2020

    Language(s):  English - French

    Published date:  10-08-2011

    Publisher:  International Electrotechnical Committee

    Add to Watchlist

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 General description
    4 Test apparatus and materials
    5 Procedure
    6 Summary

    Abstract - (Show below) - (Hide below)

    Specifies a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62182. (01/2005) Stability Date: 2015. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    BS EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    I.S. EN 60749-20-1:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    CEI EN 60749-20-1 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    NF EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    04/30119207 DC : DRAFT AUG 2004 IEC 60747-20-1 - SEMICONDUCTOR DEVICES - PART 20-1: HANDLING, PACKING, LABELLING, SHIPPING AND USE OF MOISTURE REFLOW SENSITIVE SURFACE MOUNT DEVICES
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    PD IEC/TS 62686-1:2015 (published 2015-04) Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-25:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
    IEC 60749-5:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
    IEC 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    IEC 60749-11:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD
    IEC 60749-33:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
    IEC 60749-24:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective