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IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IEC Q 03-1 : 2.0
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 1: GENERAL REQUIREMENTS FOR ALL IECQ SCHEMES
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IEC 60749-28:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
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IEC Q 03-6 : 2.0
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 6: IECQ ITL SCHEME - INDEPENDENT TESTING LABORATORY ASSESSMENT PROGRAM REQUIREMENTS
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IEC 60749-21:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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IEC Q 03-3 : 2.1
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME
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IEC 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
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IEC 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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IEC 60749-29:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
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IEC 60749-11:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
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IECQ 03-3-2:2014
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 3-2: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT - AUTOMOTIVE QUALIFICATION PROGRAMME (IECQ AC-AQP)
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IEC Q 01 : 5.0
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES
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IEC Q 03-3-1 : 1ED 2013
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3-1: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT-TECHNOLOGY CERTIFICATION (IECQ AC-TC)
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IEC 60749-15:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
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IEC 60749-26:2013
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
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IEC Q 03-4 : 3.0
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT
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IEC Q 03-7 : 1ED 2013
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 7: IECQ COUNTERFEIT AVOIDANCE PROGRAMME (IECQ AP-CAP) - PROGRAMME REQUIREMENTS
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IECQ 03-5:2014
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 5: IECQ HSPM SCHEME - HAZARDOUS SUBSTANCE PROCESS MANAGEMENT REQUIREMENTS
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IEC 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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IEC 60749-42:2014
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Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
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IEC 60068-2-1:2007
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Environmental testing - Part 2-1: Tests - Test A: Cold
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IECQ 01A:2013
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - IECQ GUIDE - GUIDANCE FOR THE USE OF THE IECQ LOGO AND IECQ MARK OF CONFORMITY
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IEC Q 03-2 : 2.1
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 2: IECQ APPROVED PROCESS SCHEME
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IEC Q 03-8 : 1ED 2015
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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 8: IECQ SCHEME FOR LED LIGHTING
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IEC 60749-23:2004+AMD1:2011 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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IEC 60068-2-30:2005
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Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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