We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
  • IEC 60749-5:2017

    Current The latest, up-to-date edition.
    Add to Watchlist
    This Standard has been added successfully to your Watchlist.
    Please visit My Watchlist to see all standards that you are watching.
    Please log in or to add this standard to your Watchlist.
    We could not add this standard to your Watchlist.
    Please retry or contact support for assistance.
    You need to be logged in to add this standard to your Watchlist.
    Please log in now or create an account to add.
    You already added this Product in the Watchlist.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  10-04-2017

    Publisher:  International Electrotechnical Committee

    Add to Watchlist

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General
    5 Equipment
    6 Test conditions
    7 Procedures
    8 Failure criteria
    9 Safety
    10 Summary

    Abstract - (Show below) - (Hide below)

    Gives a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62161 (04/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2023. (04/2017)
    Document Type Test Method
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
    14/30296894 DC : 0 BS EN 62830-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 1: VIBRATION BASED PIEZOELECTRIC ENERGY HARVESTING
    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    07/30162213 DC : 0 BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    16/30341341 DC : 0 BS EN 60749-4 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    BS IEC 60747-14-4:2011 (published 2011-02) Semiconductor devices. Discrete devices Semiconductor accelerometers
    IEC 62830-3:2017 SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING
    17/30336994 DC : 0 BS IEC 62969-3 ED.1.0 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 3: SHOCK DRIVEN PIEZOELECTRIC ENERGY HARVESTING FOR AUTOMOTIVE VEHICLE SENSORS
    BS IEC 60747-14-5:2010 Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor
    14/30301992 DC : 0 BS EN 62830-3 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    15/30269562 DC : 0 BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS
    CEI EN 60749-24 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    BS EN 62047-5 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    BS EN 60749-24 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    I.S. EN 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
    I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
    BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
    BS EN 60749-4 : 2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) (IEC 60749-4:2017)
    BS IEC 62830-3 : 2017 SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING
    IEC 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    IEEE C62.35:2010 STANDARD TEST METHODS FOR AVALANCHE JUNCTION SEMICONDUCTOR SURGE-PROTECTIVE DEVICE COMPONENTS
    IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    CEI EN 60747-15 : 2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
    I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
    CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
    I.S. EN 62047-5:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    EN 60749-43 : 2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS (IEC 60749-43:2017)
    I.S. EN 60749-24:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    BS EN 60749-30 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    I.S. EN 60749-30:2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    CEI EN 60749-4 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    NBR IEC 60749-30 : 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
    IEC 62830-1:2017 SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 1: VIBRATION BASED PIEZOELECTRIC ENERGY HARVESTING
    IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
    IEC 60749-30:2005+AMD1:2011 CSV SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    IEC 60749-24:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    PD IEC/TS 62686-1:2015 (published 2015-04) Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    EN 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    NF EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    EN 62047-5 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES
    EN 60749-24 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective