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  • IEC 60749-8:2002

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    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s): 

    Published date:  30-08-2002

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 General terms
       3.1 Units of pressure
       3.2 Standard leak rate
       3.3 Measured leak rate
       3.4 Equivalent standard leak rate
    4 Bomb pressure test
    5 Fine leak detection: radioactive krypton method
       5.1 Object
       5.2 General description
       5.3 Personnel precautions
       5.4 Procedure
       5.5 Specified conditions
       5.6 Gross leak detection
    6 Fine leak detection: tracer gas (helium) method with mass
       spectrometer
       6.1 General
       6.2 Method 1: specimens not filled with helium during
            manufacture - Fixed method
       6.3 Method 2: specimens not filled with helium during
           manufacture - Flexible method
       6.4 Method 3: specimens filled with helium during manufacture
       6.5 Gross leak detection
    7 Gross leaks, perfluorocarbon vapour method using electronic
       detection apparatus
       7.1 Object
       7.2 General description
       7.3 Test apparatus
       7.4 Test method
       7.5 Reject criterion
    8 Gross leak - Perfluorocarbon - bubble detection method
    9 Test condition E, weight-gain gross-leak detection
       9.1 Object
       9.2 Equipment
       9.3 Procedure
       9.4 Failure criteria
    10 Penetrant dye gross leak detection
    11 Gross leak re-test

    Abstract - (Show below) - (Hide below)

    Applies to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    15/30323391 DC : 0 BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    13/30277892 DC : 0 BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    CEI EN 60749-14 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    BS EN 60749-14 : 2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    BS EN 62572-3 : 2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    BS EN 60749-7 : 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
    I.S. EN 60749-14:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
    I.S. EN 60749-7:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES (IEC 60749-7:2011 (EQV))
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    IEC 60749-14:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    CEI EN 60749-7 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
    IEC 60749-7:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
    IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
    PD IEC/TS 62686-1:2015 (published 2015-04) Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    EN 62572-3 : 2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
    EN 60749-14 : 2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    EN 60749-7 : 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
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