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IEC 61190-1-3:2007+AMD1:2010 CSV

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

31-12-2021

Language(s)

English, English - French

Published date

10-11-2010

IEC 61190-1-3:2007+A1:2010 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc. This consolidated version consists of the second edition (2007) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

Committee
TC 91
DocumentType
Standard
Pages
90
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

CEI EN 62137-1-4 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 62137-1-5:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
16/30353588 DC : 0 BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
12/30274796 DC : 0 BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX
I.S. EN 62739-1:2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV))
BS EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
BS EN 16602-70-08:2015 Space product assurance. Manual soldering of high-reliability electrical connections
06/30153520 DC : DRAFT JULY 2006 EN 62468 - THE MARKING FOR PRESENCE AND ABSENCE OF THE SPECIFIED CHEMICAL SUBSTANCE IN MATERIALS, COMPONENTS AND MOUNTED BOARDS IN ELECTRICAL AND ELECTRONIC EQUIPMENT
BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
07/30169763 DC : 0 BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
13/30260487 DC : 0 BS EN ISO 9453 - SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS
CEI EN 61189-5-2 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
PREN ISO 9453 : DRAFT 2013 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO/DIS 9453:2013)
I.S. EN 62137-1-4:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
I.S. EN 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
NF EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 62137:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
14/30309696 DC : 0 BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
EN 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
EN 62137:2004/corrigendum:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
CEI EN 62739-2 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
CEI EN 62137-1-5 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
CEI EN 61189-5-3 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
05/30129049 DC : DRAFT FEB 2005 IEC 62025-2 - HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
NF EN 62137-1-5 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
BS EN 62137-1-5:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
CEI EN 62739-1 : 2014 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
12/30274800 DC : 0 BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE
I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
CEI EN 60749-21 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
I.S. EN 62739-2:2016 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
I.S. EN 62137-1-2:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 60068-2-83:2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
DIN EN ISO 9453 E : 2014 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO 9453:2014)
IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
UNI EN ISO 9453 : 2014 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS
BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
14/30309692 DC : 0 BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS
BS EN 62137:2004 Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
BS EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
12/30250506 DC : DRAFT MAR 2012 BS EN 62739-1 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
CEI EN 62739-3 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
BS EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
BS EN 61190-1-2:2014 Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
09/30208696 DC : 0 BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
NF EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
05/30133283 DC : DRAFT MAY 2005 IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
BS EN 60068-2-54:2006 Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
BS EN 62137-1-2:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
BS EN 62025-2:2005 High frequency inductive components. Non-electrical characteristics and measuring methods Test methods for non-electrical characteristics
I.S. EN 61191-6:2010 PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
I.S. EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
CEI EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
I.S. EN 60068-2-54:2006 ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
BS EN ISO 9453:2014 Soft solder alloys. Chemical compositions and forms
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
I.S. EN ISO 9453:2014 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO 9453:2014)
12/30274804 DC : 0 BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE
BS EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
BS EN 61191-6:2010 Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
I.S. EN 62025-2:2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
BS EN 62137-1-4:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
14/30317095 DC : 0 BS EN 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
I.S. EN 16602-70-08:2015 SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS
BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
NF EN 62137-1-4 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
I.S. EN 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
CEI EN 62137-1-1 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
CEI EN 60068-2-54 : 2007 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
I.S. EN 61020-1:2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 61189-6:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES
I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
UNE-EN ISO 9453:2015 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
IEC 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
IEC 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
EN 62137-1-1 : 2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
EN 62739-1 : 2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
EN 16602-70-08:2015 Space product assurance - Manual soldering of high-reliability electrical connections
BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
12/30271778 DC : 0 BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
BS EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment Generic specification
UNE-EN 61020-1:2011 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
CEI EN 62137-1-2 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
BS IEC 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
BS EN 60749-21:2011 Semiconductor devices. Mechanical and climatic test methods Solderability
I.S. EN 61189-11:2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
16/30338642 DC : 0 BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD
BS EN 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
12/30258438 DC : 0 BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
BS EN 60068-2-69:2017 Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
05/30138801 DC : DRAFT SEP 2005 IEC 60068-2-20 ED 5 - BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-20: TEST - TEST T - TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF LEADED DEVICES
CEI EN 60068-2-69 : 2008 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
I.S. EN 62137-1-1:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
I.S. EN 61189-5-3:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
DIN EN ISO 9453:2014-12 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
EN 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
EN 60068-2-83 : 2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
OVE/ONORM EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
EN 62025-2:2005 High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification

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