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IEC 61192-2:2003

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English - French

Published date

14-03-2003

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Interpretation of requirements
   4.4 Antistatic precautions
5 Component preparation processes
6 Solder paste deposition process qualification
   6.1 Solder paste characteristics
   6.2 Assessment of the process
   6.3 Solder paste deposition - Screen and stencil printing
        methods - Process control limits
7 Non-conductive adhesive deposition process
   7.1 Pot life
   7.2 Inter-stage storage and handling
   7.3 Adhesive tackiness
   7.4 Assessment of the adhesive attachment process
   7.5 Adhesive deposition - Syringe dispensing method - Small
        components - Process control limits
8 Temporary masking processes
9 Component placement processes
   9.1 Assessment of the process
   9.2 Discrete components with gull-wing leads
   9.3 IC components with flat-ribbon, L- or gull-wing leads on
        two sides
   9.4 IC components with flat-ribbon, L- or gull-wing leads on
        four sides, for example, quad flat packs
   9.5 Components with round or flattened (coined) leads
   9.6 IC component packages with J-leads on two and four sides,
        for example, SOJ, PLCC
   9.7 Leadless rectangular components with metallized
        terminations
   9.8 Components with cylindrical endcap terminations
   9.9 Bottom-only terminations on leadless components
   9.10 Leadless chip carriers with castellated terminations
   9.11 Components with butt leads
   9.12 Components with inward L-shaped ribbon leads
   9.13 Flat-lug leads on power dissipating components
10 Post-placement rework
   10.1 Rework of components placed on solder paste
   10.2 Rework of components placed on non-conductive adhesive
11 Adhesive curing
12 Soldering processes
13 Cleaning processes
14 Hand placement and hand soldering, including hand
   rework/repair
15 Electrical test
Annex A (normative)
   A.1 Introduction
   A.2 Example solder fillets and alignment: flat-ribbon, L- and
        gull-wing leads
   A.3 Example solder fillets and alignment: round or flattened
        (coined) leads
   A.4 Example solder fillets and alignment: J-leads
   A.5 Example solder fillets and alignment: rectangular or
        square end leadless components
   A.6 Example solder fillets and alignment: cylindrical end cap
        terminations, for example, MELFs
   A.7 Example solder fillets and alignment: bottom-only
        terminations on leadless components
   A.8 Example solder fillets and alignment: leadless chip
        carriers with castellated terminations
   A.9 Example solder fillets and alignment: butt joints
   A.10 Example solder fillets and alignment: inward L-shaped
        flat ribbon leads
   A.11 Example solder fillets and alignment: flat-lug leads on
        power dissipating components
Figures

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

DevelopmentNote
To be used in conjunction with IEC 61192-1, IEC 61192-3 and IEC 61192-4. (03/2003) Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
127
PublisherName
International Electrotechnical Committee
Status
Withdrawn

BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
BS EN 61188-5-1:2002 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
97/206324 DC : DRAFT MAY 1997
UTEC 90 720-1 : 2000 ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
BS 6221-25:2000 Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies
I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
97/230541 DC : DRAFT AUG 1997
IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
ISO 9002:1994 Quality systems — Model for quality assurance in production, installation and servicing
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 9001:2015 Quality management systems — Requirements
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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