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IEC 61192-4:2002

IEC 61192-4:2002

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English - French

Published date

29-11-2002

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection technique
   4.4 Interpretation of requirements
5 Process characterization
   5.1 Wire preparation processes
   5.2 Terminal mounting processes
   5.3 Soldering terminal
   5.4 Solderability
   5.5 Preconditioning
   5.6 Mechanical securing
6 Wire preparation attributes
   6.1 Insulation stripping
   6.2 Twisted strands
7 Connector pins and terminals
   7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
   8.1 Wire selection
   8.2 Wire routing
   8.3 Staking
   8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
   10.1 Post terminations
Figures
Table

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

DevelopmentNote
Stability Date: 2017. (09/2017)
DocumentType
Standard
Pages
59
PublisherName
International Electrotechnical Committee
Status
Withdrawn

BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
97/206324 DC : DRAFT MAY 1997
BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
I.S. EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
97/230541 DC : DRAFT AUG 1997
IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General

IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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